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1/17 www.rohm.com 2011.08 - rev.c ? 2011 rohm co., ltd. all rights reserved. single-chip type with built-in fet switching regulators high-efficiency step-up switching regulators with built-in power mosfet bd8152fvm,bd8158fvm description bd8152fvm,bd8158fvm are the 1-channel step- up switching regulator which builds in the low voltage fet. input voltage is 2.5 v to 5.5 v (bd8152fvm), 2.1v to 5.5v(bd8158fvm) re alizing the low consumption power. high accuracy feedback voltage ? 1% is established and the brightness dis persion of tft-lcd panel is suppressed. features 1) current mode pwm system 2) input voltage is 2.5 v to 5.5 v (bd8152fvm), 2.1 v to 5.5 v (bd8158fvm, providing the low power input) 3) switching frequency is variable as 600 khz/1,200 khz. 4) built-in 0.25 power switch 5) feedback voltage 1.245 ? 1% 6) built-in under-voltage lockout protection circuit 7) built-in overcurrent protection circuit 8) built-in thermal shutdown circuit applications 7 to 17 inches panels for the satellite navigation system, laptop pc tft-lcd panels absolute maximum ratings (ta = 25 ) parameter symbol limit unit power supply voltage vcc 7 v power dissipation pd 588* mw operating temperature range bd8152fvm topr ? 40 to +85 bd8158fvm ? 40 to +125 storage temperature range tstg ? 55 to +150 switch pin current isw 1.5** a switch pin voltage vsw 15 v maximum junction temperature tjmax 150 * reduced by 4.7 mw/ over 25 , when mounted on a glass epoxy board (70 mm ? 70 mm ? 1.6 mm). ** must not exceed pd. recommended operating ranges (ta = 25 ) parameter symbol limit unit min. typ. max. power supply voltage (bd8152fvm) vcc 2.5 3.3 5.5 v power supply voltage (bd8158fvm) vcc 2.1 2.5 4.0(5.5)* v switch current isw - - 1.4 a switch pin voltage vsw - - 14 v *specified at 600khz switching operating. no.11027ect20
bd8152fvm, bd8158fvm technical note 2/17 www.rohm.com 2011.08 - rev.c ? 2011 rohm co., ltd. all rights reserved. electrical characteristics bd8152fvm (unless otherwise specified, ta = 25 ; vcc = 3.3 v; enb = 3.3 v) parameter symbol limit unit conditions min. typ. max. [triangular waveform oscillator] oscillating frequency 1 fosc1 540 600 660 khz fclk = 0 v oscillating frequency 2 fosc2 1.08 1.20 1.32 mhz fclk = vcc [overcurrent protection circuit] overcurrent limit isw - 2 - a [soft start circuit] ss source current iso 6 10 14 a vss = 0.5 v [under-voltage lockout protection circuit] off threshold voltage vutoff 2.1 2.2 2.3 v on threshold voltage vuton 2.0 2.1 2.2 v [error amp] input bias current ib - 0.1 0.5 a feedback voltage vfb 1.232 1.245 1.258 v buffer [output] on resistance ron - 250 380 m ? *isw = 1 a max. duty ratio dmax 72 80 88 % rl = 100 [enb] enb on voltage von vcc ? 0.7 vcc - v enb off voltage voff - 0 vcc ? 0.3 v [overall] standby current istb - 0 10 a venb = 0 v average consumption current i cc - 1.2 2.4 ma no switching ? this product is not designed for protection against radio active rays. * design guarantee (no total shipment inspection is made.) electrical characteristics bd8158fvm (unless otherwise specified, ta = 25 ; vcc = 2.5 v; enb = 2.5 v) parameter symbol limit unit conditions min. typ. max. [triangular waveform oscillator] oscillating frequency 1 fosc1 480 600 720 khz fclk = 0 v oscillating frequency 2 fosc2 0.96 1.20 1.44 mhz fclk = vcc [overcurrent protection circuit] overcurrent limit isw - 2 - a [soft start circuit] ss source current iso 6 10 14 a vss = 0.5 v [under-voltage lockout protection circuit] off threshold voltage vutoff 1.7 1.8 1.9 v on threshold voltage vuton 1.6 1.7 1.8 v [error amp] input bias current ib - 0.1 0.5 a feedback voltage vfb 1.232 1.245 1.258 v buffer [output] on resistance ron - 250 - m ? *isw = 1 a max. duty ratio dmax - 85 - % rl = 100 [enb] enb on voltage von vcc ? 0.7 vcc - v enb off voltage voff - 0 vcc ? 0.3 v [overall] standby current istb - 0 10 a venb = 0 v average consumption current i cc - 1.2 2.4 ma no switching ? this product is not designed for protection against radio active rays. * design guarantee (no total shipment inspection is made.)
bd8152fvm, bd8158fvm technical note 3/17 www.rohm.com 2011.08 - rev.c ? 2011 rohm co., ltd. all rights reserved. reference data (unless otherwise specified, ta = 25 ) 0.00 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00 01234 supply voltage:vcc [v] supply current:icc [ma ] -2.000 -1.500 -1.000 -0.500 0.000 0.500 1.000 1.500 2.000 01234 supply voltage:vcc [v] standby current:icc [ua] 1.230 1.235 1.240 1.245 1.250 1.255 1.260 -40 - 15 10 35 60 85 110 ambient temperature:ta [ ] reference voltage:vref[v ] fig. 2 standby current fig. 3 reference voltage vs temperature fig. 4 ss source current -20 -16 -12 -8 -4 0 00.511.52 ss voltage:vss[v] ss current:iss[ua ] fig. 5 reference voltage vs power supply voltage 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 024 supply voltage:vcc[v] reference voltage:vref[v 0 500 1000 1500 2000 -40 - 15 10 35 60 85 110 vcomp[v] icomp[ua] fig. 8 enb pin current 0 5 10 15 20 0.0 0.5 1.0 1.5 2.0 2.5 3.0 enb voltage:venb[v] enb current:ienb[ua] 125c -40c 25c fig. 9 comp sinking vs source current -100 -50 0 50 100 1.0 1.1 1.2 1.3 1.4 1.5 vcomp[v] icomp[ua] fig. 6 switching frequency temperature vfclk=vcc vfclk=gnd 0 5 10 15 20 0.0 0.5 1.0 1.5 2.0 2.5 3.0 fclk voltage:vfclk[v] fclk current:ifclk[ua] fig. 7 fclk pin current 125c 25c -40c 125c 25c -40c fig. 1 total supply current 125c 25c -40c bd8158fvm
bd8152fvm, bd8158fvm technical note 4/17 www.rohm.com 2011.08 - rev.c ? 2011 rohm co., ltd. all rights reserved. reference data (unless otherwise specified, ta = 25 ) 50 60 70 80 90 100 2.0 2.5 3.0 3.5 4.0 supply voltage:vcc[v] efficiency [%] 80 85 90 95 100 - 40 -15 10 35 60 85 110 ambient temperature:ta [ ] max duty [% ] 50 60 70 80 90 0.05 0.1 0.15 0.2 0.25 0.3 output current:io[a] efficiency [%] fig. 10 max. duty ratio temperature vcc = 2.5 v f = 1200 khz fig. 11 vcc = 2.5v power efficiency fig. 12 vcc = 5v power efficiency vcc = 2.5 v f = 600 khz 8 8.2 8.4 8.6 8.8 9 0.0 0.1 1.0 load current:io[a] output voltage:vo[v ] fig. 13 power efficiency vs power supply voltage fig. 14 max. load current vs power supply voltage 0 0.2 0.4 0.6 0.8 2.0 2.4 2.8 3.2 3.6 4.0 supply voltage:vcc[v] maximum current:iomax[a] fig. 15 load response waveform io = 0 ma vo io = 100 ma 100 mv 20 us f = 600 khz f = 1200 khz 8 8.2 8.4 8.6 8.8 9 2.0 2.5 3.0 3.5 4.0 supply voltage:vcc[v] output voltage:vo[v ] fig. 16 output voltage line regulation fig. 17 output voltage load regulation 1 vcc = 2.5 v fig. 18 output voltage load regulation 2 bd8158fvm bd8158fvm bd8158fvm bd8158fvm 50 60 70 80 90 0.05 0.15 0.25 0.35 0.45 output current:io[a] efficiency [%] bd8152fvm 8 8.2 8.4 8.6 8.8 9 0.0 0.1 1.0 load current:io[a] output voltage:vo[v ] bd8152fvm vcc=5v
bd8152fvm, bd8158fvm technical note 5/17 www.rohm.com 2011.08 - rev.c ? 2011 rohm co., ltd. all rights reserved. block diagram top view pin assignment diagram and function pin no. pin name function 2 fb error amp inversion input pin 3 enb control input pin 4 gnd ground pin 5 sw n-channel power fet drain output 6 vcc power supply input pin 7 fclk frequency switching pin 8 ss soft start current output pin uvlo/tsd + sense current 1.245v sw vcc gnd fclk ss pwm +- 8 7 6 5 osc sl ope set drv sdwn logic re s et err -+ start soft 1 2 3 4 comp fb enb ocp vref vcc ss fclk sw comp fb enb gnd fig. 19 pin arrangement diagram and block diagram
bd8152fvm, bd8158fvm technical note 6/17 www.rohm.com 2011.08 - rev.c ? 2011 rohm co., ltd. all rights reserved. description of operation of each block ? error amp (err) this is the circuit to compare the reference voltage 1.245 v (typ.) and the feedback voltag e of output voltage. switching duty is decided by the comp pin voltage which is the comparison result. at the time of start, since the soft start is operated by the ss pin voltage, the comp pin voltage is limited to the ss pin voltage. ? oscillator (osc) this block generates the oscillating frequency. it is possi ble to select 600 khz/1.2 mhz (typ.) by the fclk pin. ? slope this block generates the triangular waveform from the cl ock generated by osc. generated triangular waveform is sent to the pwm comparator. ? pwm output comp voltage of the error am p and the triangular waveform of the slope block are compared to decide the switching duty. since the switching duty is limited by the maximum duty ratio which is decided internally, it does not become 100%. ? reference voltage (vref) this block generates the internal reference voltage of 1.245 v (typ.). ? protection circuit (uvlo/tsd) uvlo (under-voltage lockout protection circuit) shuts down the circuits when the voltage is 2.2 v (typ.bd8152fvm),1.8 v (typ.bd8158fvm) or lower. thermal shutdown circuit shuts down ic at 175 (typ.) and recovers at 160 (typ.). ? overcurrent protection circuit (ocp) current flowing to the power fet is detected by volta ge at the current sense and the ov ercurrent protection operates at 3 a (typ.). when the overcurrent prot ection operates, switching is turned off and the ss pin capacity is discharged. ? soft start circuit since the output voltage rises gradually while restricting the cu rrent at the time of startup, it is possible to prevent the output voltage overshoot or the inrush current. fig. 20 application circuit diagram example vcc vout uvlo/tsd + sense current 1.245v sw vcc gnd fclk ss pwm + - 8 7 6 5 osc slope set drv sdwn logic reset err - + start soft 1 2 3 4 comp fb enb ocp vref 10uf 10uh 10uf rb161m-20 c1 c2 0.01uf c3 3300pf r3 5.1k r1 110k r2 18k l1 d1 c0 9v c4 100pf
bd8152fvm, bd8158fvm technical note 7/17 www.rohm.com 2011.08 - rev.c ? 2011 rohm co., ltd. all rights reserved. timing chart startup sequence overcurrent protection operating io 2.5v vcc,enb ss sw vo fig. 21 startup sequence waveform fig. 22 overcurrent protection operating waveform vcc enb ss sw vo
bd8152fvm, bd8158fvm technical note 8/17 www.rohm.com 2011.08 - rev.c ? 2011 rohm co., ltd. all rights reserved. selecting application components (1) setting the output l constant the coil l to use for output is decided by the rating current i lr and input current maximum value i inmax of the coil. adjust so that i inmax + ? i l does not reach the rating current value i lr . at this time, ? i l can be obtained by the following equation. ? i l = 1 vcc ? vo - vcc ? 1 l vo f set with sufficient margin because the coil l value may have the dispersion of approx. ? 30%. if the coil current exceeds the rating current i lr of the coil, it may damage the ic internal element. bd8152fvm,bd8158fvm use the current mode dc/dc converter control and has the optimized design at the coil value. the following coil values are recommended from the aspects of power efficiency, response and safety. when the coil out of this range is selected, the stable continual operation is not guaranteed such as the switching waveform becomes irregular. please pay attention to it. switching frequency: l = 10 uh to 22 uh at 600 khz switching frequency: l = 4.7 uh to 15 uh at 1,200 khz (2) setting the output capacitor for the capacitor c to use for the output, select the capa citor which has the larger value in the ripple voltage v pp allowance value and the drop voltage allowance value at the time of sudden load change. output ripple voltage is decided by the following equation. perform setting so that the voltage is within the allowable ripple voltage range. for the drop voltage during sudden load change; v dr , please perform the rough calculat ion by the following equation. v dr = ? i ? 10u sec [v] co however, 10 ? s is the rough calculation value of the dc/dc response speed. please se t the capacitance considering the sufficient margin so that these two val ues are within the standard value range. (3) selecting the input capacitor since the peak current flows between the input and output at t he dc/dc converter, a capacitor is required to install at the input side. for this reason, the low esr capacitor is recommended as an input ca pacitor which has the value more than 10 f and less than 100 m . if a capacitor out of this range is selected, the excessive ripple voltage is superposed on the input voltage, accordingly it may cause the malfunction of ic. however these conditions may vary according to the load current, input voltage, output voltage, inductance and switching frequency. be sure to perform the margin check using the actual product. ? v pp = i lmax ? r esr + 1 ? vcc ? (i lmax - ? i l ) fco vo 2 il t i inmax + ? i l should not reach the rating value level ilr i inmax average current [a] where, f is the switching frequency. [v] where, f is the switching frequency. fig. 23 coil current waveform fig. 24 output applic ation circuit diagram l vcc i l vo co
bd8152fvm, bd8158fvm technical note 9/17 www.rohm.com 2011.08 - rev.c ? 2011 rohm co., ltd. all rights reserved. (4) selecting the output rectification diode schottky barrier diode is recommended as the rectification di ode to use at the dc/dc conver ter output stage. select the diode paying attention to the max. in ductor current and max. output voltage. max. inductor current i inmax + ? i l < rating current of diode max. output voltage v omax < rating voltage of diode since each parameter has 30% to 40% of dispersion, be sure to design providing sufficient margins. (5) design of the feedback resistor constant refer to the following equation to set t he feedback resistor. as the setting range, 10 k to 330 k is recommended. if the resistor is set to 10 k or lower, it causes the reduction of power efficiency. if it is set to 330 k or larger, the offset voltage becomes larger by the input bias current 0.4 a (typ.) in the internal error amp. step-up (6) setting the soft start time soft start is required to prevent the co il current at the time of startup from increasing and the overshoot of the output voltage at the starting time. fig.26 shows the relation between the capacitance and soft start time. please refer to it to set the capacitance. as the capacitance, 0.001 f to 0.1 f is recommended. if the capacitance is set to 0.001 f or lower, the overshooting may occur on the output voltage. if the capacitance is set to 0.1 f or la rger, the excessive back current flow may occur in the internal parasitic elements when the power is turned off and it may damage ic. when the capacitor to 0.1 f or larger is used, be sure to insert a diode to vcc in series, or a bypass diode between the ss pin and v cc. fig. 27 bypass diode example when there is the startup relation (sequences) with other power su pplies, be sure to use the high accuracy product (such as x5r ). soft start time may vary according to the input voltage, output voltage, loads, coils and output capacity. be sure to verify the operation using the actual product. (7) setting the enb pin when the enb pin is set to hi, the internal circuit becomes active and the dc/dc converter starts operating. when it is set to low, the shut down is activated and all circuits will be turned off. (8) setting the frequency by fclk it is possible to change the switching frequency by setting the fclk pin to hi or low. when it is set to low, the product operates at 600 khz (typ.). when it is set to hi, the product operates at 1,200 khz (typ.). vo = r8 + r9 ? 1.245 [v] r9 vo r8 r9 err reference voltage 1.245 v fb 2 0.01 0.1 1 10 0.001 0.01 0.1 ss capacitance[uf] delay time[ms] fig. 25 feedback resistor setting vcc output pin back current prevention diode bypass diode fig. 26 ss pin capacitance vs delay time
bd8152fvm, bd8158fvm technical note 10/17 www.rohm.com 2011.08 - rev.c ? 2011 rohm co., ltd. all rights reserved. (9)setting r c , c c of the phase compensation circuit in the current mode control, since the coil current is controlled, a pole (phase lag) made by the cr filter composed of the output capacitor and load resistor will be created in the low frequency range, and a zero (phase lead) by the output capacitor and esr of capacitor will be created in the high fr equency range. in this case, to cancel the pole of the power amplifier, it is easy to compensate by adding the zero point with c c and r c to the output from the error amp as shown in the illustration. open loop gain pole at the power amplification stage when the output current redu ces, the load resistance ro increases and the pole frequency lowers. error amp phase compensation zero at the power amplification stage when the output capacitor is set larger, the pole frequency lowers but the zero frequency will not change. (this is because the capacitor esr becomes 1/2 when the capacitor becomes 2 times.) it is possible to realize the stable feedback loop by canceling the pole fp (min.), which is created by the output capacitor and load resistor, with cr zero compensation of the error amp as shown below. fz (amp.) = fp (min.) 1 = 1 2 ? ? rc ? cc 2 ? ? romax ? co as the setting range for the resistor, 1 k to 10 k is recommended. when the resistor is set to 1 k or lower, the effect by phase compensation becomes low and it may cause the oscillation of output voltag e. when it is set to 10 k or larger, the comp pin becomes hi-z and the switch ing noise becomes easy to superpose. therefore the stable switching pulse cannot be generated and the irregular ripple voltage may be generated on the output voltage. as the setting range for the capacitance, 3,300 pf to 10,000 pf is recommended. when the capacitance is set to 3,300 pf or lower, the irregular ripple voltage may be generated on the outpu t voltage due to the effect of switching noise. when it is set to 10,000 pf or larger, the response becomes worse and the output voltage fluctuation bec omes large. accordingly it may require the output capacitor which is larger than the necessary value. fp = 1 2 ? ? r o ? c o fz (esr) = 1 2 ? ? e sr ? c o fp (min) = 1 [hz] ? at light-load 2 ? ? r omax ? c o fz (max) = 1 [hz] ? at heavy-load 2 ? ? r omin ? c o fp (amp.) = 1 2 ? ? r c ? c c fp(min) fp(max) fz(esr) a 0 -90 0 gain db phase deg l out min l out max 0 0 a -90 gain db phase deg v cc rc cc cin vcc,pvcc gnd,pgnd sw comp co esr ro vo l fig. 28 gain vs phase fig. 29 application circuit diagram [hz] [hz] [hz] [hz]
bd8152fvm, bd8158fvm technical note 11/17 www.rohm.com 2011.08 - rev.c ? 2011 rohm co., ltd. all rights reserved. application examples although rohm is sure that the app lication examples are recommendable ones, further check the characteristics of components that require high precision before using them. when a circuit is used modifying the externally connected circuit constant, be sure to decide allowing sufficient margins considering the dispersion of values by external parts as well as our ic including not only the static but also the transient characteristic.for the patent, we hav e not acquired the sufficient confirma tion. please acknowledge the status. (1) when the charge pump is removed from the dc/dc converter to make it 3-channel output mode: it is possible to create the charge pump by using the swit ching operation of dc/dc conv erter. when the application shown in the following diagram is used, 1-channel dc/dc converter output, 1-channel positive side charge pump and 1-channel negative side charge pump can be output as a total of 3-channels. fig. 30 3ch application circuit diagram example v cc v o uvlo/tsd + sense cu r ren t 1 . 24 5v s w vcc gnd fclk ss pwm + - 8 7 6 5 osc slope set drv sdwn lo gi c re se t err - + star t soft 1 2 3 4 comp fb enb ocp vref 10f 10h 10f rb161 m-20 c1 c2 0.01 f c3 33 00p f r3 5.1k ? r1 110k ? r2 18k ? l1 d1 c0 9v 0.1f 0.1f 1f 1f 0.1f 1f 1f vgh 1f vgl da n217 u 2sd2657k dan217u 2sb1 695 k udz series udz series 1k ? 100 k ? 1 00k ? 1k ?
bd8152fvm, bd8158fvm technical note 12/17 www.rohm.com 2011.08 - rev.c ? 2011 rohm co., ltd. all rights reserved. (2) when the output voltage is set to 0 v: since the switch does not exist between t he input and output in the application us ing the step-up type dc/dc converter, the output voltage is generated ev en if the ic is turned off. when it is int ended to keep the output voltage 0 v until ic operates, insert the switch as shown in the following circuit diagram. fig. 31 switch applicatio n circuit diagram example application examples (3) when the circuit is intended to operate at the lower voltage than the ic operating range: although the recommended operating range of ic starts from 2.5 v / 2.1 v (bd8152fvm,bd8158fvm), it is possible to continue operating by composing the self-energizing type st ep-up dc/dc converter application even if the input voltage lowered than 2.1 v. this example is recommended for the application with battery input. fig. 32 self-energizing application circuit diagram example vcc uvlo/tsd + sense current 1.245v sw vcc gnd fclk ss pwm + - 8 7 6 5 osc slope set drv sdwn logic reset err - + start soft 1 2 3 4 comp fb enb ocp vref 10uf 10uh rb161m-20 c1 c2 0.01uf c3 3300pf r3 5.1k r1 110k r2 18k l1 d1 switches of pnp or pfet vo 1k 10uf vcc 2.0v uvlo/tsd + sense current 1.245v sw vcc gnd fclk ss pwm + - 8 7 6 5 osc slope set drv sdwn logic reset err - + start soft 1 2 3 4 comp fb enb ocp vref 10uf 10uh rb161m-20 c1 c2 0.01uf c3 3300pf r3 5.1k r1 110k r2 18k l1 d1 vo 3.3v 10uf
bd8152fvm, bd8158fvm technical note 13/17 www.rohm.com 2011.08 - rev.c ? 2011 rohm co., ltd. all rights reserved. (4) sepic type application when it is intended to compose the st ep-up type dc/dc converter, the sepic type application is recommended. since the switching voltage is generated by the value of input voltage + output voltage, pay utmost att ention to the withstand voltage of sw pin. fig. 33 sepic application circuit diagram example (5) when the supply voltage is over 4.0 v (bd8158fvm only) the capacitor c4 is inserted to comp pin, and it operates when the supply voltage is over 4.0 v. in this case, switching frequency is limited to 600khz. fig.34 circuit diagram example(supply voltage over 4.0 v ) vcc uvlo/tsd + sense current 1.245v sw vcc gnd fclk ss pwm + - 8 7 6 5 osc slope set drv sdwn logic reset err - + start soft 1 2 3 4 comp fb enb ocp vref 10uf 10uh rb161m-20 c1 c2 0.01uf c3 3300pf r3 5.1k r1 110k r2 18k l1 d1 vo 10uf 10uh 4.7uf uvlo/tsd + sense current 1.245v sw vcc gnd fclk ss pwm + - 8 7 6 5 osc slope set drv sdwn logic reset err - + start soft 1 2 3 4 comp fb enb ocp vref 10uf 10uh rb161m-20 c1 c2 0.01uf c3 3300pf r3 5.1k r1 110k r2 18k l1 d1 vo 10uf c4 100pf
bd8152fvm, bd8158fvm technical note 14/17 www.rohm.com 2011.08 - rev.c ? 2011 rohm co., ltd. all rights reserved. i/o equivalent circuit diagrams 1.comp 5.sw 2.fb 8.ss 3.enb 7.fclk fig. 34 i/o equivalent circuit diagram notes of use 1) absolute maximum ratings use of the ic in excess of absolute ma ximum ratings such as the applied voltage or operating temperature range may result in ic damage. assumptions should not be made regardin g the state of the ic (short mode or open mode) when such damage is suffered. a physical safety measure such as a fu se should be implemented when use of the ic in a special mode where the absolute maximum ratings may be exceeded is anticipated. 2) gnd potential ensure a minimum gnd pin potentia l in all operating conditions. 3) setting of heat use a thermal design that allows for a suffic ient margin in light of the power dissipa tion (pd) in actual operating conditions. 4) pin short and mistake fitting use caution when orienting and positioning the ic for mounting on an application board. improper mounting may result in damage to the ic. shorts between output pins or between out put pins and the power supply and gnd pins caused by the presence of a foreign object may result in damage to the ic. 5) action in strong magnetic field use caution when using the ic in the pres ence of a strong magnetic field as doi ng so may cause the ic to malfunction. vcc vcc vcc vcc vcc 130k
bd8152fvm, bd8158fvm technical note 15/17 www.rohm.com 2011.08 - rev.c ? 2011 rohm co., ltd. all rights reserved. 6) testing on application boards when testing the ic on an application boar d, connecting a capacitor to a pin with low impedance subjects the ic to stress. always discharge capacitors after each process or step. ground the ic during assembly steps as an antistatic measure, and use similar caution when transporting or st oring the ic. always turn the ic's power supply off before connecting it to or removing it from a jig or fixtur e during the inspection process. 7) ground wiring patterns when using both small signal and large current gnd patterns, it is recommended to isolate the two ground patterns, placing a single ground point at the application's referenc e point so that the pattern wiring resistance and voltage variations caused by large currents do not cause variations in the small signal ground voltage. be careful not to change the gnd wiring patterns of any external components. 8) this monolithic ic contains p+ isolat ion and p substrate layers between adjacent elements in order to keep them isolated. p/n junctions are formed at the intersection of these p layers with the n layers of other elements to create a variety of parasitic elements. for example, when the resistors and transistors are connected to the pins as shown in fig. 35, a parasitic diode or a transistor operates by inversing the pin voltage and gnd voltage. the formation of parasitic elements as a result of the relationships of the potentials of different pins is an inevitable resul t of the ic's architecture. the operation of parasitic elements can cause interference with circuit operation as well as ic malfunction and damage. for these reasons, it is necessary to us e caution so that the ic is not used in a way that will trigger the operation of parasitic elemen ts, such as the application of voltages lo wer than the gnd (p substrate) voltage to input and output pins. fig.35 example of a simple monolithic ic 9) overcurrent protection circuits an overcurrent protection circuit designed according to t he output current is incorpor ated for the prevention of ic destruction that may result in the event of load shortning. this protection circuit is effect ive in preventing damage due to sudden and unexpected accidents. however, the ic should not be used in applications characterized by the continuous operation or transitioning of the protection circuits. at the time of thermal de signing, keep in mind that the current capabili ty has negative characteristics to temperatures. 10) thermal shutdown circuit (tsd) this ic incorporates a built-in tsd circuit for the protecti on from thermal destruction. t he ic should be used within the specified power dissipation range. however, in the event that the ic continues to be oper ated in excess of its power dissipation limits, the attendant rise in the chip's temperature tj will trigger the temperature protection circuit to turn off all output power elements. the circuit automatically resets once the chip's temperature tj drops. operation of the tsd circuit presumes that the ic's absol ute maximum ratings have been exceeded. application designs should never make use of the tsd circuit. 11) testing on application boards at the time of inspection of t he installation boards, when the capacitor is c onnected to the pin with low impedance, be sure to discharge electricity per process because it may load stresses to the ic. always turn the ic's power supply off before connecting it to or removing it from a jig or fixture during the inspection proce ss. ground the ic during assembly steps as an antistatic measure, and use similar cautio n when transporting or storing the ic. parasitic elements (pin b) gnd c b e (pin a) gnd n p n n p p resistor parasitic element p parasitic element gnd (pin a) gnd n p n n p p parasitic elements p substrate (pin b) c b e transistor (npn) n gnd
bd8152fvm, bd8158fvm technical note 16/17 www.rohm.com 2011.08 - rev.c ? 2011 rohm co., ltd. all rights reserved. power dissipation reduction power dissipation:pd[mw] fig. 36 power dissipation reduction ambient temperature[ ] 0 25 50 75 100 125 800 200 600 400 150 on 70 70 1.6mm board 85 588 bd 81 52fvm bd8158fvm
bd8152fvm, bd8158fvm technical note 17/17 www.rohm.com 2011.08 - rev.c ? 2011 rohm co., ltd. all rights reserved. ordering part number b d 8 1 5 2 f v m - e 2 part no. part no. 8152 8158 package fvm:msop8 packaging and forming specification tr: embossed tape and reel (msop8) (unit : mm) msop8 0.08 s s 4.00.2 8 3 2.80.1 1 6 2.90.1 0.475 4 57 (max 3.25 include burr) 2 1pin mark 0.9max 0.750.05 0.65 0.080.05 0.22 +0.05 ?0.04 0.60.2 0.290.15 0.145 +0.05 ?0.03 4 + 6 ?4 direction of feed reel ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper right when you hold reel on the left hand and you pull out the tape on the right hand 3000pcs tr () 1pin
r0039 a www.rohm.com ? 2009 rohm co., ltd. all rights reserved. notice rohm customer support system http://www.rohm.com/contact/ thank you for your accessing to rohm product informations. more detail product informations and catalogs are available, please contact us. notes no copying or reproduction of this document, in part or in whole, is permitted without the consent of rohm co.,ltd. the content specied herein is subject to change for improvement without notice. the content specied herein is for the purpose of introducing rohm's products (hereinafter "products"). if you wish to use any such product, please be sure to refer to the specications, which can be obtained from rohm upon request. examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the products. the peripheral conditions must be taken into account when designing circuits for mass production. great care was taken in ensuring the accuracy of the information specied in this document. however, should you incur any damage arising from any inaccuracy or misprint of such information, rohm shall bear no responsibility for such damage. the technical information specied herein is intended only to show the typical functions of and examples of application circuits for the products. rohm does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by rohm and other parties. rohm shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. the products specied in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, ofce-automation equipment, commu- nication devices, electronic appliances and amusement devices). the products specied in this document are not designed to be radiation tolerant. while rohm always makes efforts to enhance the quality and reliability of its products, a product may fail or malfunction for a variety of reasons. please be sure to implement in your equipment using the products safety measures to guard against the possibility of physical injury, re or any other damage caused in the event of the failure of any product, such as derating, redundancy, re control and fail-safe designs. rohm shall bear no responsibility whatsoever for your use of any product outside of the prescribed scope or not in accordance with the instruction manual. the products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel-controller or other safety device). rohm shall bear no responsibility in any way for use of any of the products for the above special purposes. if a product is intended to be used for any such special purpose, please contact a rohm sales representative before purchasing. if you intend to export or ship overseas any product or technology specied herein that may be controlled under the foreign exchange and the foreign trade law, you will be required to obtain a license or permit under the law.

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